Chemical - each measure that mechanical polish uses extensively already at semiconductor chip to make, the irregular exterior configuration with multiform level off. When if be in,making contemporary semiconductor integrated circuit, need forms electric line, or the new circuit that other type forms above the structure that forms before. The structure that forms before however often is in of silicon chip apparently stay very not neat, bumpy protruding peak, indentation and groove. This kind not neat after the gender can be caused, deposit layer cannot be enclothed completely in chip apparently, cause the rupture of deposit material. This kind not neat if the gender is not seasonable eliminate, the surface after deposit can become more irregular, pose more problems thereby, the accumulation that if be in,irregular layer can appear in process of further treatment semiconductor. Appear when these deposit not neat when, can produce a lot of character that do not hope. These character depend on the utility that the type of material and they will come to. What go up in insulation oxidation layer is not complete the meeting that award a lid brings about the short circuit between metallization. And empty existence can include the gas that in keeping air and process, uses, and the reliability that reduces whole parts of an apparatus. Cause abnormality possibly also in the sharp point on conductor, the field effect that does not hope. Anyhow, be in not neat the function that very poor serviceability rate or parts of an apparatus can cause when high density circuitry is being machined on sexual structure. Accordingly, to make multilayer the treatment of integrated circuit becomes easy, and the performance that improves a product, dependability and serviceability rate, it is very important that the level off of integrated circuit structure is changed. Actually, all high density integrated circuit make a technology use the polishing method of some kind of means now, in order to get very flowing structure. The supersonic chemistry of semiconductor chip - the new technology that the company of LSI Logic Corporation that mechanical polish is the United States develops, won American patent in September 1993, its patent date is " 5245790 " . The main part of equipment of this kind of polish is a rotational platform of many polish gasket 106 (5-5 seeing a picture) . It is fixed go up in a runner shaft coming back, can drive platform to turn continuously. Rotational platform upper part secured gasket of polish of two dish form (102 with 108) , there is state of a layer on the base of gasket of polish of every dish form pressure quick energy converter (110 with 104) , it can accept installation to be in the energy converter of rotational platform lower part 250 those who transmit exceed sound energy and make gasket produces supersonic vibration. The oar stuff that has chemistry and mechanical polish function is supplied by special abrasive implement (114) arrive through carrying conduit N6 on dish form mat, silicon chip can have supersonic chemistry on dish form mat - mechanical polish, gain extremely shining chip face thereby. CNC Milling